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PMT-16
Home » Products » Precious Metal » PMT-16

PMT-16 Precious Metal Wafer Electroplating System
Wafers up to 10" x 10" (250 x 250 mm)

Gold, Gold-Alloy
Silver, Silver Alloy
Tungsten, Tungsten Alloy
Palladium, Palladium Alloy
Rhodium, Rhodium Alloy

Features
  • One Plating Cell
  • High/Flow/Filtration (enhanced filtration yields fewer defects)
  • Increased filtration speeds shim production
  • Microprocessor controlled
  • Repeatability for uniform results
  • Precise control of plating thickness and thickness variation
  • Ergonomically designed
  • Easy process maintenance

Optional Reverse Pulse Plating - RPP


PMT-16.jpg

PMT-16-Dimension-Drawing-(Front-Side-View).jpg

 

Specifications

Equipment Dimensions
Wafer dimensions Standard
Total Solution Volume
Heaters
Temperature Control
Cells

580 x 920 x 1220 mm (L x W xH)
4,6, and 8" round or square
16 Liters
1kW
+/- 1 degree
1

Each cell

ElectricalExhaustDI Water

200-230 VAC, 16 A, 1 Phase, 50/60 hz.400 CFM>17 Meg-Ohm, 1/2" 45 psi,  50 lpm on demand
Each cell
Pump
Plating Current

Filtration



1/2 HP

0 to 27 Amps

Single 10" .45 micron

 

 

 

 

 

 

 

 

 

 

 

 

 

 
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